Job description
學歷
大學(含)以上
希望到職日期
2026-03-01T00:00:00+08:00
出差派駐
無需
薪資
面議
專業技能
掌握半導體元件物理基礎與電路學；瞭解 IC 設計流程；對次世代半導體材料或成熟製程應用具備初步認知。 Mastery of device physics and circuit theory; understanding of IC design flows and next-gen semiconductor materials.
需求系所 (Preferred Majors): 電機、電子、物理、材料、光電 (Electrical, Electronic, Physics, Materials, Photonics)
工作職責
協助執行 IC 設計驗證、先進封裝測試與製程數據分析。參與功率半導體研發專案的實驗採集；配合追蹤良率數據，學習車用電子零件之設計與整合規範。 Assist in IC design verification, advanced packaging testing, and process data analysis. Participate in power semiconductor R&D data collection. Support yield tracking and learn automotive component design specs.