Job description
This role leads internal and field failure investigations by performing hands-on physical and electrical analysis using advanced techniques like SEM, FIB, and EDX.
Key responsibilities include
driving root-cause problem solving and corrective actions, developing standard FA procedures, mentoring junior staff, and collaborating with cross-functional engineering teams to enhance product quality and design reliability.
Requirements
Bachelor’s or Master’s degree in Electrical Engineering with 4–5 years of relevant engineering experience. Familiar with ISO quality system. Familiar with Semiconductor Assembly BE process. Have good knowledge in 6Sigma, DMAIC, SPC, FMEA, and Lean Manufacturing. Strong theoretical and practical knowledge of semiconductor device processing and packaging technologies Benefits 13th month Chance to be part of company transformation