Foxconn

(10)【2026新幹班】AI伺服器硬體類 AI Server Hardware

Foxconn

TWPosted Aug 4, 2026

Job description

學歷

大學(含)以上

希望到職日期

2026-03-01T00:00:00+08:00

出差派駐

無需

薪資

面議

專業技能

熟悉 Cadence 或 Altium 設計軟體;具備電子電路學基礎與數位電路分析概念,對高效能運算 (HPC) 硬體發展有濃厚興趣。 Familiarity with Cadence or Altium. Foundation in electronic circuit theory and digital circuit analysis. Strong interest in HPC hardware development.

需求系所 (Preferred Majors): 電機工程、電子工程、光電學門、物理系 (Electrical, Electronic, Photonics, Physics)

工作職責

協助設計高效能伺服器與超算機櫃之主板、CPU/GPU 載板電路圖。參與先進運算架構之硬體原型功能測試、零件選型與初步 BOM 製作。配合資深工程師學習高速訊號完整性 (SI/PI) 模擬分析技術,支援液冷散熱機構的初步設計驗證與電源傳輸網路測試。 Assist in designing circuit diagrams for AI server mainboards and CPU/GPU carrier boards. Participate in functional testing of hardware prototypes for advanced computing architectures. Support part selection and initial BOM creation. Collaborate with engineers to learn SI/PI simulation and support initial liquid cooling design and PDN testing.