Job description
Drive the optimization and establishment of robust, high-speed process parameters for diverse component attach, complex stack-ups, and advanced molding technologies (Transfer and Compression) Define and implement simplified, lean manufacturing process sequences for multi-component assembly to enhance throughput and reduce cycle time Establish stable, high-speed parameters for multi-chip attach and advanced wire bonding technologies, ensuring structural integrity and electrical performance in leaded modules Apply comprehensive technical expertise in Leadframe, Direct Bonded Copper (DBC), and MIS manufacturing to optimize module reliability and thermal performance Requirements Bachelor’s degree in Mechanical Engineering, Physics, Material Science, or a related field of study Minimum 5 years-experience in the semiconductor field Expert level experience in process development for power stage, multi chip module.
Package layer design expertise such as structural configuration, material selection and process flow design Hands on skills in operating machines and knowledge to down-select material, process optimization and yield improvement Expert experience of using ANSYS / FEA for stress modeling.
Benefits
- Competive Salary
- Career Growth Plans