<2026 Internship Program> Process Engineer Intern (Wire Bonding)

To work with operation/maintenance to ensure production smoothly. To assist action confirmations with system monitors. To work with Engineers for yield improvements from the study of stable plasma cleaning as the leading indicator. Job Qualification: Understanding of Plasma cleaning principle for wire bonding Integrity Chip die pad/wire type/Lead-post structures Bachelor's or Master's student in Material/Science/Electronic Engineering or related Available to work at least 3 days/week.

Good verbal and written English communication skills MS Office or Programming skill Self-motivated, results oriented, willing and eager to learn, proactive attitude More information about NXP in Greater China... #LI-2370