About BE Semiconductor Industries NV
BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.
Founded in 1995 by Richard Blickman.
- Founded
- 1995
- Employees
- 1,001 to 5,000
- Headquarters
- Duiven 6921
Leadership
The top of BE Semiconductor Industries NV's org chart, with how many people report into each leader.
Richard Blickman
CEO
7 reports
Henk-Jan Jonge Poerink
SVP Global Operations
3 reports
René Hendriks
SVP Sales North America & Europe
J.K. Park
SVP Sales & Customer Support APac
Ruurd Boomsma
CTO Besi
Board
Carlo Bozotti
Board Member
Niek Hoek
Board Member
Lodewijk Hijmans Van Den Bergh
Chairman
Laura Oliphant
Board Member
Elke Eckstein
Board Member
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