PCB Technology For Thermal Management and Heat Dissipation Solution jobs and careers

About PCB Technology For Thermal Management and Heat Dissipation Solution

Heavy Copper PCB & Metal Embedded PCB Technology For Thermal Management and Heat Dissipation Solution Provider, 20oz heavy copper ,cavity plating , edge plating ,plating over filled via (POFV)technology for thermal managment and heat sink dissipation solution . We began developing and producing The Metal based and metal embeded PCB since 1997, including Copper Inlay PCB, thick Copper PCB, Combination PCB, Bus Bar Embedded PCB, Aluminum Base PCB and Ceramic PCB. To date,we offer five kind of PCB solution for thermal dissipation and management to meet the needs of various power supply such like the Power inverter \Battery Management System,EV Charger ,Power Distribution Unit and so on!