NPI Process Engineer, Senior

Senior NPI Process Engineer About the Role: We are seeking an experienced Senior New Product Introduction (NPI) Process Engineer to lead the successful introduction of new Power RF products from development into manufacturing. The successful candidate will play a critical role in coordinating cross-functional teams and OSAT partners to ensure smooth product qualification, process readiness, and timely release to mass production.

This position requires a strong background in semiconductor backend packaging, project management, and problem-solving, with the ability to drive product launches from concept to production while meeting quality, cost, and schedule objectives.

Key Responsibilities

Lead and coordinate New Product Introduction (NPI) activities from product development through production release. Work closely with Product Engineering, Design Engineering, Test Engineering, Supply Chain, Quality, and OSAT partners to ensure successful product launch. Review and interpret assembly drawings, bill of materials (BOM), process flows, and product specifications.

Evaluate package designs against manufacturing capabilities and design rules. Develop and continuously improve NPI processes to streamline product release and reduce cycle time. Support engineering builds, qualification runs, and production ramp activities. Drive root cause analysis and corrective actions for issues encountered during qualification and production.

Collaborate with OSAT partners to resolve assembly, qualification, and yield-related challenges. Monitor key performance indicators including yield, quality, cycle time, and productivity. Stay informed of emerging semiconductor packaging technologies and manufacturing capabilities to support future product requirements.

Support yield improvement and productivity enhancement activities for newly released products.

Requirements

Bachelor's Degree in Mechanical Engineering, Manufacturing Engineering, Materials Engineering, Electrical Engineering, or other related Physical Sciences disciplines. Experience: Minimum 5 years of experience in semiconductor backend packaging or assembly manufacturing. Minimum 5 years of project management experience within semiconductor manufacturing environments.

Hands-on experience working with OSATs and new product qualification activities. Technical Knowledge Strong understanding of: Die preparation Eutectic/Epoxy die attach Wire bonding processes Automated Optical Inspection (AOI) End-of-Line (EOL) processes Product qualification methodologies Failure analysis and root cause investigation FOL (Front-of-Line) processes and working knowledge of EOL and Test processes Skills Competencies Strong project management and organizational skills.

Excellent analytical and problem-solving abilities. Effective communication and stakeholder management skills. Ability to work in a fast-paced, cross-functional environment. Self-driven, results-oriented, and able to manage multiple projects simultaneously. Strong teamwork and collaboration mindset.

Preferred Qualifications

Experience supporting Power RF, RF, Power Discrete, or related semiconductor products. Familiarity with APQP, FMEA, Control Plans, SPC, and Problem-Solving methodologies (8D, Fishbone, 5-Why). Experience working with OSAT providers such as ASE, Amkor, Unisem, Carsem, JCET, or similar.