NXP Semiconductors
826 open roles
Pr. HV-BCD Device engineer
HsinchuFull-timePosted Aug 2, 2026
Job description
• Role Purpose – Lead the development and optimization of high-voltage (HV) and BCD device architectures. This role requires a deep understanding of device physics and a data-driven approach to ensure industry-leading performance and reliability for power management solutions.
- Key Responsibilities – Device Development: Lead the architecture design and optimization of HV devices (LDMOS, EDMOS, ESD) on 180nm to 55nm BCD nodes. – Physics Analysis: Analyze and optimize Device Physics parameters, including BV, Rdson , SOA, and reliability (HCI/NBTI). – Simulation & Modeling: Utilize TCAD for 2D/3D process and device simulations to accelerate development cycles. – Device Verification: Define verification plans and execute statistical analysis using JMP for DOE and WAT data. – Design Integration: Work within Cadence environments for layout review and test structure design. – Cross-functional Collaboration: Partner with PI and PE teams to resolve yield, reliability, and manufacturing bottlenecks.
- Required Qualifications – Experience: Master’s or Ph.D. in EE, Physics, or related field with 10+ years of semiconductor industry experience. – Technical Expertise:
- Profound knowledge of Device Architecture and Device Physics.
- Hands-on experience in 180nm to 55nm BCD process nodes. – Tools:
- Expertise in TCAD (Sentaurus / Silvaco ).
- Expertise in JMP for statistical data analysis.
- Proficiency in Cadence (Layout/Virtuoso).
- Preferred Qualifications (Plus) – Advanced Power Devices: Experience with GaN , SiC , or IGBT development. – Silicon Photonics: Knowledge of Photonics integration and device physics. – Domain Knowledge:
- Process Integration (PI): Understanding of mask flow and doping profiles.
- Product Engineering (PE): Experience in CP/FT data correlation and yield enhancement.
- Competencies – Accountability: Strong ownership of project milestones and outcomes. – Critical Thinking: Ability to identify root causes in complex device failures. – Interpersonal Skills: Effective communication across design and foundry teams. – Data-driven: Committed to objective decision-making through rigorous data analysis. More information about NXP in Greater China... #LI-7743
Description copied from NXP Semiconductors's careers page. Read the full posting before you apply.
More jobs at NXP Semiconductors
Intern (Engineering & IT)
NXP Semiconductors· Kuala LumpurSenior ASIC Design Engineer
NXP Semiconductors· PuneSr Manager - Mass Market Technical Leader - Americas
NXP Semiconductors· 2 LocationsBootROM Lead Architect
NXP Semiconductors· 2 LocationsSenior Validation Engineer (f/m/d)
NXP Semiconductors· Hamburg
More jobs in Hsinchu
Customer Support Technician 客戶支援助理工程師
Applied Materials· Hsinchu, TWN審計類(新竹)-資深審計員
PwC Ireland· HsinchuTW Engineer - FS II, TF CVD
Lam Research· TW-Hsinchu-01 (3103)Senior Software Engineer, Platform Portability
Roku· Hsinchu, TaiwanCustomer Service Engineer- Hsinchu
KLA Corporation· Hsinchu, Taiwan