Senior Packaging Failure Analysis Engineer

About Us

n. Eye.ai, a well-funded optical switch startup, is poised to revolutionize the future of data centers. n. Eye’s MEMS-based silicon photonics optical circuit switches (OCS) eliminate critical bottlenecks in AI processing by enabling direct optical connections among thousands of GPUs and memory units. The company's Super.

Switch is an ultra-low power consumption, high radix, compact chip-scale design, offering hyperscale data centers enhanced performance, efficiency, and scalability.

Position Summary

We are seeking a hands-on Senior Packaging Failure Analysis Engineer to lead root-cause investigation of complex failures across our silicon photonics, MEMS, optical packaging, and electronic assemblies. This role will have a particular focus on cross-sectioning bonded components and analyzing material interfaces, including adhesive/epoxy attach, fusion and eutectic bonding, solder interconnects, and hermetic packages.

The ideal candidate combines a strong foundation in materials science and interfacial phenomena with deep practical experience in failure analysis, microscopy, analytical characterization, and sample preparation. You will own investigations from initial non-destructive analysis through destructive physical analysis, determine the appropriate characterization technique for each problem, translate findings into actionable root cause and corrective actions, and feed learnings back into product design, packaging, manufacturing, and supplier processes.

Over time, this individual may also play a key role in building and expanding in-house failure analysis capabilities, including cross-sectioning/polishing, microscopy, SEM/EDS, and related analytical infrastructure.