Wire Bond Process Engineer

Responsible for line sustaining issues & full accountability of outgoing yield and quality of Wire Bond process. KPIV, KPOV & LoD are key. Updating documentation on a timely manner (FMEA, WI, POCAP, CP, Build sheet…etc). Hands on & run the equipment/process in production mode. Expected to spend time on the production floor daily.

Equip with wire bond process knowledge through self-learning and able to do some minor troubleshooting whenever there are any quality/maverick issues occur. Work closely with cross functional team like equipment, PO & Quality team on any issues arise. Work closely with R&D for new product development to ensure robust process & manufacturability.

Support new product pre-series and ramp-up. Initiate cost & yield improvement projects which may need to drive the upstream process on any incoming quality deviations. What we look for Min Bachelor's Degree in Electrical / Electronics / Mechanical Engineering or equivalent. Preferred with min 8 years working experience in High Volume Manufacturing and Complex process for IC or LED manufacturing.

Experience in the Wire Bond process is highly preferred. 6 Sigma Methodology, Green/Black Belt is an advantage. Process control knowledge-Control Plan, FMEA, SPC, MSA, 8D, DOE, Minitab, PBI. Please contact Nurul Ain Rosli for further information via NURUL-AIN.ROSLI@AMS-OSRAM.COM or +60 (4) 3053200 .