Principal Analog System Architect

Architecture Definition & Trade‑offs – Define end‑to‑end system architectures for next‑gen sensor ICs, balancing performance, power, area, scalability, manufacturability, yield, and cost. Cross‑domain Partitioning – Lead architecture across analog, digital, firmware, algorithms, and interfaces to ensure optimal implementation strategies.

Innovation & Technology Scouting – Evaluate new circuit techniques, architectures, and emerging technologies to drive future differentiation. Validation & Iteration – Build system‑level models/simulations; analyze silicon characterization data to identify architectural limitations and define improvement plans. Strategic Influence – Contribute to technology roadmaps, support key customer engagements, and mentor senior engineering staff.

Who we are looking for Required Qualifications Education – Master’s or Ph.D. in EE, Microelectronics, Semiconductor Physics, or related field. Experience – 15+ years in analog/mixed‑signal IC development, including significant hands‑on analog circuit design and substantial architectural leadership. Core Technical Expertise – Deep transistor‑level design proficiency in at least one of: Analog Front‑Ends (AFE), Precision Analog, Low‑Noise Signal Chains, Data Converters (ADC/DAC), Power Management, Timing/Clock Generation, Sensor Interface Circuits.

System Thinking – Proven ability to perform architecture trade‑offs (noise, power, area, reliability, yield, cost) and to connect circuit implementation with product requirements. Cross‑functional Leadership – Experience driving technical decisions across analog, digital, firmware, algorithm, verification, and product development teams.

Soft Skills – Strong analytical, communication, and presentation skills. Fluent English; Mandarin proficiency highly desirable.

Preferred Qualifications

Sensor Experience – Optical sensing (ALS, Proximity, ToF, Spectral, Imaging) or full signal‑chain optimization. Specialized Skills – Ultra‑low‑power, precision analog, ADC/DAC architectures, PLL/timing, power management, or sensor readout circuits. Additional Knowledge – Image/signal processing, sensor fusion, edge ML, or embedded systems.

Process & Validation – Multiple technology nodes, behavioral modeling, system simulation, silicon characterization. Impact – Patents, publications, or contributions to long‑term technology strategy. Please contact Jingjing Hu for further information via TINA.HU@AMS-OSRAM.COM or +86 (510) 81908303 .