Senior Thick Film & Microelectronics Quality Engineer

We are seeking a Senior Thick Film & Microelectronics Quality Engineer to support quality requirements for our thick film fabrication and microelectronics assembly operations. You will manage quality requirements for thick film processing, plating, wire bonding, light assembly and soldering. This role assists in defining and ensuring strict compliance with AS9100 standards while driving continuous improvement through lean manufacturing principles.

Key Responsibilities

Quality Assurance & Compliance Maintain and improve the AS9100 Quality Management System (QMS). Lead root cause analysis using 8D, 5-Whys, and Fishbone methodologies. Manage the Material Review Board Meetings, timely material disposition and non-conformance reporting. Conduct internal audits and support customer/third-party audits Author and update Control Plans, PFMEAs, and inspection plans and procedures.

Familiarity with product related statutory and regulatory requirements. Supply Chain, Process & Production Support Define, oversee and document the required quality standards for thick film printing, firing, laser trimming and any other associated processes. Monitor and validate electroless/electroplating chemical processes and thickness.

Establish inspection criteria for wire bonding (ball, wedge, ribbon) and other associated assembly and thick film processing processes. Define quality controls for manual and automated assembly, test and inspection processes. Perform and document requirements for destructive/nondestructive testing as they relate to internal and customer requirements.

Manage Supplier Quality KPI’s. Interact with suppliers to ensure capability and conformance to defined requirements. Ensure customer flow downs are properly documented and adhered to. Continuous Improvement Participate in Lean Manufacturing initiatives to reduce waste and cycle times. Apply SPC (Statistical Process Control) to monitor process capabilities.

Optimize production yields through structured DoE (Design of Experiments).

Qualifications

& Skills Required Education & Experience Bachelor’s degree in Engineering, Materials Science, or a related technical field. 3+ years of quality engineering experience in microelectronics or semiconductor manufacturing or printed circuit board fabrication. Direct experience with thick film manufacturing and associated assembly processes.

Technical Knowledge Proficient knowledge of AS9100 or ISO 9001 quality standards. Familiarity with plating processes (nickel, gold, silver) and surface finishes. Working knowledge of associated GEA and MIL Standard for product testing and inspection criteria. Proficiency in statistical software. Working knowledge of APQP, PPAP, DFMEA/PFMEA Preferred Certifications ASQ Certified Quality Engineer (CQE).

Six Sigma Green Belt or Black Belt.