Signal Integrity Intern

Meta is seeking a platform Signal Integrity (SI) intern to join our Infra HDRTP team. The team is responsible for designing, optimizing, and validating cutting-edge hardware platforms for Meta's rapidly expanding AI, compute, storage, and network infrastructure. As a platform SI intern, you will contribute to the design phase of NPI projects, collaborating closely with XFN team members and ODM partners. This role offers hands-on experience with state-of-the-art hardware technologies and expert mentorship from seasoned professionals within the team.

This is a 12 week internship in Menlo Park, California.

Responsibilities

• Collaborate on the development of AI and network hardware designs and system solutions, guiding them from conceptualization to deployment
• Contribute to defining requirements for novel solutions and spearhead the design, development, and testing of passive and active electrical interfaces in the high-speed links (224Gbps+, PCIe Gen6+, and other interfaces)
• High-speed modeling and simulation (pre-layout and post-layout SI analysis)
• PCB stackup analysis and AC/DC power integrity validation
• COM and IBIS-AMI model simulation
• Designing, developing, and testing components, as well as creating software automation for systems and products leveraging diverse technologies
• Work in a collaborative environment across Meta, with system suppliers and ASIC suppliers, to drive Meta's requirements for development, planning, operation, and fleet deployment

Qualifications

• Currently pursuing or holding a Master's degree in Electrical Engineering, Computer Science and Engineering, or a related field
• Demonstrated theoretical foundation and practical experience in electrical design and validation
• Experience with computer and server system architecture
• Proficiency in CAD software for 1)Schematic capture 2)PCB layout 3)ADS simulation
• Must obtain work authorization in the country of employment at the time of hire, and maintain ongoing work authorization during employment
• Intent to return to full-time degree program after completion of the internship Theoretical and practical knowledge in high speed signal integrity design and validation, as well as electromagnetic, antenna and microwave
• Experience with board design from schematic entry to board layout and fabrication
• Knowledge or experience in semiconductor devices, VLSI design, microelectronic device
• Experience with standard SI/PI tools (e.g. HFSS, CST, HyperLynx, ADS, Spice)
• Familiarity with IEEE 802.3.dj specifications as well as the COM tool
• Practical experience with lab tools (e.g. Spectrum Analyzer, VNA, TDR, and real-time or sampling scope)
• Demonstrated analytical and problem-solving skills, and able to work independently