Lead High-Speed PCB Layout Engineer

About Us

Array Labs builds advanced radar systems to help humanity understand and respond to changes across the physical world. We're launching a coordinated fleet of radar satellites to create a high-resolution 3D map of the Earth, updated in real time, enabling faster, smarter decision-making for government and commercial organizations supporting disaster response, infrastructure resilience, and mission-critical geopolitical intelligence.

We design and build our satellites end-to-end, producing the world's most advanced earth observation satellites. Our fleet will deliver unprecedented levels of accuracy, coverage, and responsiveness to power critical insights precisely where they're needed most.

About the Job

As a Lead High-Speed PCB Layout Engineer, you will own the physical implementation of Array’s high-speed digital and mixed-signal electronics in Altium, translating schematics and performance requirements into layouts and functional designs. Your work will include component placement, constraint-driven routing, stack-up definition, return path and reference plane strategy, and partitioning between sensitive mixed-signal domains and high-speed digital interfaces.

You will partner closely with electrical design, firmware, mechanical, and test engineers to drive layout constraints, reviews, and manufacturing releases. The boards you ship will directly determine signal integrity, power integrity, noise performance, and overall system reliability in the lab and on orbit.

Responsibilities

Own high-speed PCB layout from initial placement through manufacturing release in Altium Define and implement stack-ups, impedance targets, length-matching constraints, and reference plane/return-path strategies for high-speed interfaces Translate schematic intent into layouts that meet signal integrity and power integrity requirements across mixed-signal and digital domains Partner with electrical design, firmware, mechanical, and test engineers to develop layout constraints, run reviews, and de-risk first-pass success Drive DFM/DFT considerations with fabrication and assembly partners, including documentation and release artifacts Basic Qualifications B.

S. in Electrical Engineering, or a related field with 8+ years of relevant experience Experience in PCB layout, fabrication, and release of high-speed digital and mixed-signal electronics Excellent teamwork and communication skills Learns new concepts rapidly, completely, and in a self-directed manner High levels of self-motivation and personal accountability Ability to work in a fast-paced environment under significant time constraints Preferred Skills & Experience