Advanced Packaging Die Placement Engineer - Staff

Bold Thinking. World Changing. At Sky. Water, our ingenuity helps improve lives around the world by manufacturing U.S. made semiconductors that are essential ingredients of modern life. Automotive safety enhancements, life-saving medical devices, consumer electronics and American security require semiconductors. Working in our Minnesota headquarters, Florida, or Texas location — employees join together to improve the world.

Explore what’s possible. Joining our U.S. - based team means contributing to and learning about the commercialization of some of the most exciting technologies the world has ever seen. We are turning “science fiction” into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro-mechanical systems and other emerging device topologies.

We manufacture products for aerospace and defense, medical, automotive, consumer and industrial markets, to name a few. Our customers include emerging leaders who rely on our intellectual property security and quality manufacturing services. Step into the future. Sky. Water’s values of Integrity, Excellence, Collaboration, Empowerment and Growth Mindset guide us to cultivate an empowered, learning environment.

We also invest in developing highly skilled, dedicated employees — and employees who are entering the workforce for the first time, from the military, and a variety of educational backgrounds. Are you bold thinking? Find your place on our team and help us change the world!

Position Summary

We are looking for a hardworking, and passionate experienced Die Placement / Pick and Place Development Engineer for our Florida Advanced Packaging site. In this role, you will be responsible to lead, develop and improve the overall die placement process flows to deliver a qualified product to our foundry clients. Excellent oral and written communication skills are required to communicate ideas with foundry customers, colleagues, and management.

Major Areas of Accountability: Transfer a client’s package requests into a die placement / pick and place process flow that may utilize Si interposer, Fan. Out, superconducting materials and hybrid bonding manufacturing processes. The die placement may be incorporated within a final package such as in the fanout flows, be part of hybrid bonding of devices, utilize die last as part of wafer level assembly or utilized in a substrate assembly flow.

Identify areas that require development and lead the module team to deliver on schedule and with high yield a qualifiable final product. Highlight any potential gaps in a process flows and build external partnerships to enable fast turn prototyping. When required, lead task forces to identify root causes, correct and maintain product deliverables.

Support integration engineers to enable new process needs for each project. Create training documents & write technical papers to teach state-of-the-art technologies within Sky. Water and external. Gain / utilize knowledge of the capabilities and interdependencies of tool sets within the process flow to create recipes that die placement that comprehend upstream and downstream product requirements and process flows.

Process integration for a wide variety of clients that include MEMS / Photonics / High Performance Computing / CMOS / Memory / AI / Quantum devices Integrate TSV first and / or TSV last process flows to enable Foundry client packages. Utilize metrology tools to characterize process conditions, identify root cause of any defects and document results.

Investigate and drive integration changes for improved device performance and yield improvement. Work with process and tool engineers to find processing marginalities and make improvements. Routinely monitor selected in line and end of line SPC charts for trends or excursions that can be addressed by integration changes.

Utilize data analysis software to drive data driven decisions Create quick turn cycles of learning to identify issues early and create a final product and process flow for Foundry clients. Incorporate, monitor and improve electrical test parametrics to deliver an electrically good final package. The job also requires performing other duties as assigned.

Percentages of time spent on job duties are estimates and may vary for each position. Required Qualifications: Education: BS Engineering, MS/PhD preferred Experience and Skills: 5+ years of Process Development & Integration Engineer in Advanced Packaging Fab environment of 10K and 1K clean rooms related to Fan. Out wafer level assembly, Quantum, Si Interposer and Hybrid Bonding.

Advanced Packaging Fab processing tools knowledge/experience MEMS / Photonic / HPC / AI / ASIC / Quantum device and integration knowledge with relevant combination of years of experience and/or advanced degree. Knowledge of DOE, SPC, and 6-sigma concepts and applications. Project Management skills and/or defined training a plus.

Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes. Can work both independently and in cross-functional teams for problem solving. US Citizenship Required : This position will require the holding of or ability to obtain government security clearance which requires U.

S Citizenship. #sw2 The annual salary range for this role is $95,200 - $142,800. Pay offered is based on many factors, including, but not limited to, the job-related experience, skills, education, and credentials of each candidate. Sky. Water offers an exciting environment where the brightest semiconductor minds come together to achieve exceptional results.

We offer competitive salary and an opportunity to participate in incentive plans as well as other employee financial benefits, including 401k match, and life insurance. Additionally, Sky. Water offers a comprehensive benefits package which promotes a healthy life. This includes benefit eligibility day one, medical, dental, mental health benefits, vision, legal planning, short- and long-term disability, paid time off, paid holidays, an on-site fitness facility, and an on-site self-serve market.

Sky. Water complies with federal and state disability laws and makes reasonable accommodations for applicants and employees with disabilities unless doing so would cause an undue hardship. Alternative methods of applying for employment are available to individuals unable to submit an application through this site because of a disability.

To request reasonable accommodations, to participate in the job application or interview process, to perform essential job functions, and/or to receive other benefits and privileges of employment, please contact Human Resources at 952-851-5200 or Recruiting@Sky. Watertechnology.com. EOE, including disability/vets We will never ask applicants to pay fees, purchase equipment or gift cards, or provide financial information before a formal offer of employment has been accepted.

If you receive a suspicious communication claiming to represent our company, please verify its authenticity by contacting our recruitment team at recruiting@skywatertechnology.com before responding.