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Photo Process Engineer
Job description
Join the Revolution in Semiconductor Manufacturing at LFAB! We're at the forefront of an exciting era of growth and innovation at LFAB (Lehi Fab), where our state-of-the-art manufacturing facilities are driving the production of a vast portfolio of semiconductor products. As we rapidly expand our capabilities with the construction of LFAB2, we're seeking talented and experienced Process Engineers to join our team and play a key role in shaping the future of our industry.
With production and yields on the rise, this is an unparalleled opportunity to make a meaningful impact and contribute to the success of our organization. If you're a motivated and seasoned Engineer with more than 3 years of experience in the semiconductor industry within the Photolithography process area, we invite you to join our dynamic team and help us push the boundaries of what's possible in semiconductor manufacturing.
The responsibilities of a Manufacturing Process Engineer in this role include: Support manufacturing operations Perform lot and equipment dispositions to support the continuous flow of production and to minimize cycle time in a high volume manufacturing 300mm wafer Fab running Analog Technologies Support the manufacturing ramp with execution of equipment/process startup, process experiments (SWRs) Develop and implement improved methods of manufacturing, procedures, and processes that result in improved efficiencies, yields, machine operations, and product quality Implement project or improvement plans for areas of responsibility including but not limited to: efficiency improvements, cost reduction or quality improvement programs, new product support and other process improvements Participate in data analysis and problem resolution Work onsite and be responsive to evening and weekend escalations as needed Data collection, simulation, and on silicon verification of Optical Proximity Correction (OPC) models and recipes Feedback Sub-Resolution Assist Features (SRAF) design optimizations to the Reticle Enhancement Technology (RET) team Minimum Requirements Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Physics, or a related engineering degree 3 years of engineering experience working in a Semiconductor Fab environment within Photolithography Strong foundation in statistical process control, engineering change control and process release strategies Preferred Qualifications Experience with 28nm and below Demonstrated strong analytical and problem-solving skills including model-based problem solving Excellent communication and collaboration skills Ability to work in teams and collaborate effectively with people in different functions Strong time management skills that enable multitasking and on-time project delivery Demonstrated ability to build strong, influential relationships Ability to work effectively in a fast-paced and rapidly changing environment Ability to take the initiative and drive for results Proven ability to drive results, prioritize tasks, and manage time to meet project deadlines Work experience with Source Mask Optimization (SMO) and SRAF optimization Work experience with the following OPC modeling packages: Prolith, Brion, Synopsys, and Mentor Graphics.
Programing experience in Unix
Description copied from Texas Instruments's careers page. Read the full posting before you apply.
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