Principal Microelectro Packaging Engineer

We’re looking for a Principal Microelectronic Packaging Engineer to lead the development of next-generation packaging technologies that make our microelectronic assemblies smaller, faster to manufacture, more reliable, and more cost-effective. This is a highly collaborative advanced-technology role where you’ll shape new processes and materials, guide cross-functional engineering teams, and bring innovative microelectronics concepts from experimentation and prototyping into production.