External Manufacturing NPI Engineer

External Manufacturing NPI Lead Own backend external manufacturing NPI from conceptualization, development, qualification to production launch Functional Leadership for NPI to deliver PLM requirements for new product commercialization and to co-work with cross functional team (comprising both internal and external stakeholders) to achieve on-time market release Interface & steer cross-functional team engagements across Business Units, Central Engineering, Operations, Quality, Supply Chain and Procurement to meet department objectives Drive DFM, technology & manufacturability readiness for new package & complex derivative platforms for effective POR freeze to new product industrialization Partner with OSATs to deliver assembly readiness for new product qualification.

Key activities include process flow & BOM setup, risk analysis & mitigation, process characterization, lookahead assessment, qualification and CAB preparation leading to first part release Manage production ramp: lead production safe launch, provide technical support to resolve ramp issues, develop CIP, set production baseline for transition into HVM Collaborate with internal & external partners for technology pathfinding, package roadmap as well as design rules/ guideline development Adoption of data analytics and data-driven approach to problem solving and decision making Establish Best Known Methods (BKM) and Best-in-Class practices for new package platform and fan-out to production Participate in quality and process readiness audit to achieve production site readiness Co-work with operations to drive continuous yield improvement for evolving challenges Subject Matter Expert to address arising package and assembly challenges Experienced candidate(s) will be considered for technical lead role to manage team (5-6 person) team’s performance including overall delivery, tactical, resource planning & execution Bachelor's Degree in Engineering/ Materials Science or equivalent technical background More than 10 years of experience in backend semiconductor IC manufacturing environment, with in-depth assembly process expertise and shop floor experience Strong leadership with demonstrated project management skills across multi-stakeholder and cross-functional settings Hands-on assembly process experience in leading wafer technology such as SiC, GaN and CIS Imaging is highly desirable Prior experience in NPI, product/ process integration and familiar with Chip-to-Package Interaction (CPI) effect Experience in IC package design/ CAD/ simulation/ characterization will be advantageous Good overall understanding of OSAT business landscape and operations Adept at cross-functional collaboration, Adaptable to matrix organization, strong engineering fundamentals (including DOE characterization, SPC, failure analysis) and problem-solving skills Strong project management skills and multi-stakeholder management Proficient in statistical analysis methods and familiar with data analytics Good communication skills and proficient in written & spoken English.

Spoken proficiency in Mandarin will be advantageous