Thermal Design Engineer V

Responsibilities

Overview

Build Optical Systems That Actually Fly Orion Space Solutions (OSS), part of Arcfield, designs and builds operational space payloads for national security, commercial and advanced sensing missions. Our instruments fly on orbit and deliver mission-critical data for government and commercial customers. This role is responsible for thermal system design and analysis of complex spacecraft and payloads, spanning from the lowest level component up through sub ‑ system and full system levels.

The position includes designing thermal solutions for a wide range of electronic components and ensuring thermal closure while meeting cost and schedule objective s .

Key Responsibilities

Perform thermal system design and analysis for spacecraft and payloads across component , sub ‑ system, and s pace vehicle level . Design thermal integration of electronic components such as processors, power supplies, cameras, and optical assemblies at the sub ‑ system spacecraft bus and space vehicle level. Ensure thermal designs close properly and identify innovative technical means to meet thermal, cost, and schedule requirements.

Perform FEM ‑ based thermal model analysis using Ansys Thermal Desktop. Develop preliminary concepts supporting early design activities through design V&V (verification & validation) and transition to rate production. Collaborate effectively across the team and cross-functional disciplines : avionics, mechanical, structural, program management, and AI&T teams with strong internal customer focus.

Thermal Design Engineer V, I10, ENMCEI10 Qualifications Qualifications Required Bachelor’s degree or higher in a relevant engineering or computation field plus 10 -12 years, MS plus 8-10 years, or PhD plus 5-7 years of professional experience in thermal engineering positions . 5 + years of professional working experience in the space , aerospace or other indsutry designing high reliability products .

Experience with design to ols and methods related to thermal engineering: Ansys Thermal Desktop, AutoCAD, DSS Solid. Works Preferred Ability to perform mechanical engineering design tasks using Solid. Works, in addition to primary thermal engineering duties . Understanding of GD&T tools and methods. Equal Pay Act This is the projected compensation range for this position.

There are differentiating factors that can impact a final salary/hourly rate, including, but not limited to, Contract Wage Determination, relevant work experience, skills and competencies that align to the specified role, geographic location (For Remote Opportunities), education and certifications as well as Federal Government Contract Labor categories.

In addition, Arcfield invests in its employees beyond just compensation. Arcfield ’s benefits offerings include, dependent upon position, Health Insurance, Life Insurance, Paid Time Off, Holiday Pay, Short Term and Long-Term Disability, Retirement and Savings, Learning and Development opportunities, wellness programs as well as other optional benefit elections.

Min: $121,506.18 Max: $181,352.50 EEO Statement We are an equal opportunity employer and federal government contractor. We do not discriminate against any employee or applicant for employment as protected by law.

Overview

Build Optical Systems That Actually Fly Orion Space Solutions (OSS), part of Arcfield, designs and builds operational space payloads for national security, commercial and advanced sensing missions. Our instruments fly on orbit and deliver mission-critical data for government and commercial customers. This role is responsible for thermal system design and analysis of complex spacecraft and payloads, spanning from the lowest level component up through sub ‑ system and full system levels.

The position includes designing thermal solutions for a wide range of electronic components and ensuring thermal closure while meeting cost and schedule objective s .

Key Responsibilities

Perform thermal system design and analysis for spacecraft and payloads across component , sub ‑ system, and s pace vehicle level . Design thermal integration of electronic components such as processors, power supplies, cameras, and optical assemblies at the sub ‑ system spacecraft bus and space vehicle level. Ensure thermal designs close properly and identify innovative technical means to meet thermal, cost, and schedule requirements.

Perform FEM ‑ based thermal model analysis using Ansys Thermal Desktop. Develop preliminary concepts supporting early design activities through design V&V (verification & validation) and transition to rate production. Collaborate effectively across the team and cross-functional disciplines : avionics, mechanical, structural, program management, and AI&T teams with strong internal customer focus.

Thermal Design Engineer V, I10, ENMCEI10 Qualifications Required Bachelor’s degree or higher in a relevant engineering or computation field plus 10 -12 years, MS plus 8-10 years, or PhD plus 5-7 years of professional experience in thermal engineering positions . 5 + years of professional working experience in the space , aerospace or other indsutry designing high reliability products .

Experience with design to ols and methods related to thermal engineering: Ansys Thermal Desktop, AutoCAD, DSS Solid. Works Preferred Ability to perform mechanical engineering design tasks using Solid. Works, in addition to primary thermal engineering duties . Understanding of GD&T tools and methods.