Optical System Design Lead

Position Overview

We are seeking a highly skilled and experienced Optical System Design Lead to spearhead the development of optical coupling and packaging solutions for advanced photonic devices. The ideal candidate will have a deep understanding of optical system design, coupling techniques, and packaging methodologies. This role requires a combination of technical expertise, leadership ability, and innovative thinking to drive product design and implementation from concept to manufacturing.

Key Responsibilities

● Optical System Design: ○ Lead the design and development of optical coupling systems, including fiber-to-chip and free-space coupling techniques. ○ Optimize optical interfaces for performance, reliability, and manufacturability. ● Packaging Development: ○ Design advanced photonic packaging solutions with a primary focus on ensuring optical stability.

○ Collaborate with cross-functional teams to integrate optical components into compact and scalable designs.

● Prototyping and Testing: ○ Develop prototypes for optical coupling and packaging designs. ○ Oversee testing and validation to meet performance metrics, including insertion loss, alignment tolerance, and durability.

● Collaboration and Leadership: ○ Work closely with mechanical, electrical, and manufacturing engineers to ensure seamless integration of optical subsystems. ○ Mentor and guide a team of optical engineers, fostering a culture of innovation and excellence. ● Documentation and Compliance: ○ Generate detailed technical documentation and design guidelines. ○ Ensure compliance with industry standards and regulations for optical systems and packaging.

Required Skills

& Experience:

Qualifications

● Master’s or Ph.D. in Optical Engineering, Photonics, Physics, or a related field. ● 7+ years of experience in optical system design, coupling, and packaging, preferably in photonics or a related industry. Technical Skills: ● Proficiency in optical simulation tools (e.g., Zemax). ● Expertise in optical alignment and coupling techniques (e.g., active/passive alignment, precision bonding). ● Knowledge of photonic integrated circuits (PICs) and their packaging challenges. ● Familiarity with advanced manufacturing techniques (e.g., laser welding, epoxy bonding, and hermetic sealing).