Wirebond & Die Attach Process Engineer (MES Project)

Change the world. Love your job. Texas Instruments is seeking a Process Engineer to lead the digital design of our Wire Bond and Die Attach manufacturing processes. This is a unique, multi-phase role: following a 1 month TI orientation familiarizing with TI systems while being deployed into a critical MES implementation project team for 1–2 years.

Once the system is live, you will return to a production role, using your knowledge of digital process controls to drive yield and efficiency.

Key Responsibilities

MES Implementation (Project Phase): Drive manufacturing process design within the MES. Define process flows, routing, material handling, and traceability. Control & Exception Handling: Design the digital logic for process controls and exception handling, including automated holds, rework loops, and material disposition.

Alignment & Validation: Align requirements between manufacturing and quality teams. Validate proposed digital workflows and support UAT and deployment. Sustaining (Post-Project Phase): Transition to a production role to manage process stability, use MES data for yield enhancement, and optimize process parameters (e.g., wedge bonding optimization) through the new digital framework.

Minimum requirements: Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field Strong hands-on semiconductor process experience in Wire Bond and/or Die Attach, with minimum 2 years of relevant experience Strong foundation in statistical process control, engineering change control and process release strategies Preferred qualifications: Experience working with MES platforms , whether Siemens Op.

Center or another comparable MES product modeling or configuration Working awareness of PAC-related integration and adjacent automation flows, sufficient to identify cross-system impacts and escalate early Experience in optimizing process parameters for wedge bonding or die attach accuracy. Demonstrated strong analytical and problem solving skills Strong verbal and written communication skills Ability to work in teams and collaborate effectively with people in different functions Strong time management skills that enable on-time project delivery Demonstrated ability to build strong, influential relationships Ability to work effectively in a fast-paced and rapidly changing environment Ability to take the initiative and drive for result