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Etch Equipment Engineer
Job description
NXP’s Front End Operations plays an essential role in the company’s success by ensuring manufacturing excellence and delivery of high quality, scalable, and cost-competitive semiconductor devices to create a winning advantage for our Customers. Primary Responsibilities: Engineering owner of 200mm AMAT MXP/MXP+/SUPERE/DPS/DPSII and/or TEL DRM/SCCM etch wafer fabrication equipment.
Drive equipment performance to maximize capacity and yield performance. Reduce cost of equipment ownership. Write and maintain equipment specifications. Define preventative maintenance plans and intervals. Monitor and react to statistical process control trends. Work with vendors to develop and perform equipment upgrades.
Participate in and/or lead cross-functional lean activities. Work with maintenance technicians to develop maintenance and troubleshooting skills. Job Qualifications: Position requires BS in Engineering (Mechanical, Electrical, Materials Science, or Chemical Engineering preferred) Industry experience with 200mm AMAT MXP/MXP+/SUPERE/DPS/DPSII and/or TEL DRM/SCCM equipment in a commercial Fab Experience in Lean Manufacturing a plus Ability to deal with multiple issues and shifting priorities Strong verbal and written communication skills Ability to interact with multiple disciplines in a 7x24 manufacturing facility Good problem solving skills Self-motivated; able to take initiative More information about NXP in the United States...
NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law.
In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals. #LI-97b2
Description copied from NXP Semiconductors's careers page. Read the full posting before you apply.
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