Process Engineering Wirebond

Wire Bond Process Engineer optimizes, sustains, and develops ultrasonic wire bonding processes to enhance yield, quality, and cost-efficiency in semiconductor manufacturing. Key duties include managing New Product Introductions (NPI), conducting DoE (Design of Experiments) for process optimization, troubleshooting defects (bond lifts, wire breaks), and mentoring junior staff.

Process Optimization & Development: Define, develop, and document wire bonding recipes and parameters (parameters, tools, materials) for new and existing products. Yield & Quality Improvement: Analyze yield trends, implement root-cause analyses for failures (e.g., bond lifts, cratering), and drive corrective actions (PDCA) to improve Cpk/Cp and reduce DPMO.

NPI & Qualification: Coordinate the setup, validation, and qualification of new wire bonding equipment and materials, including material characterization. Troubleshooting & Support: Provide technical, hands-on support to production teams, including troubleshooting wire bonders (e.g., K&S, ASM, Shinkawa, Orthodyne platforms).

Documentation & Compliance: Create and update process specifications, Standard Operating Procedures (SOPs), FMEA, and Control Plans to meet ISO/IATF 16949 standards. Mentorship: Coach junior engineers and technicians on technical skills and best practices.

Education

Bachelor’s or Master’s degree in Engineering (Mechanical, Electrical, Electronics, or Semiconductor Technology). Experience: Typically 5+ years of experience in semiconductor backend manufacturing, specifically in wire bonding. Technical Skills: Deep understanding of ultrasonic wire bonding techniques, materials (Au, Cu, Al wires), and equipment, along with strong data analysis skills (e.

g., Pareto analysis, SPC). Soft Skills: Strong problem-solving, collaboration, and communication skills to work with cross-functional teams.