Technician 4, Manufacturing

onsemi is seeking skilled Technicians to support semiconductor manufacturing operations in areas such as Die Bond/Clip Bonding, Wire Bonding The role involves operating and monitoring specialized equipment, performing machine setups, and ensuring production processes meet onsemi quality standards . Technicians will conduct routine checks, minor preventive maintenance, troubleshoot issues, and assist in process improvements.

Accurate data recording, adherence to 5S, safety, and ESD compliance , and strong teamwork are essential. Ideal candidates hold a Certificate/Diploma in Electrical, Mechanical, Mechatronics, or related fields, possess basic troubleshooting skills, and are willing to work shifts in a fast-paced environment. Prior experience in semiconductor processes is an advantage.

Die bond/Clip Bonder Technician – Job Description Responsibilities: -Operate and monitor die bond/clip bonder machines to ensure stable production output. -Perform die/clip attach processes according to SOP, work instructions, and Onsemi quality standards. -Machine model involve will be ASM ( AD838, Twin 832P, SD890A, AD832D, ) & Shinkawa / Yamaha ( SPA 500, STC 500 ) -Conduct machine setup Minor/Major, alignment, recipe loading, and basic parameter adjustments.

-Perform regular machine checks, cleaning, and minor preventive maintenance. -Identify process abnormalities, machine errors, and reject trends; report issues to engineers or supervisors promptly. -Assist in troubleshooting equipment issues and support engineering improvement activities. -Record production data accurately in system and ensure proper documentation.

-Ensure workplace 5S, safety compliance, and proper ESD handling at all times. Wire Bonder Technician – Job Description Responsibilities: -Operate and monitor wire bonder machines to ensure stable production output. -Perform wire bond processes according to SOP, work instructions, and Onsemi quality standards. -Machine model involve will be ASM ( Extreme family, Twin supreme, Eagle 60, ) / Shinkawa / Yamaha ( ACB 3000, ACB 1000, UTC 5100) / Kns ( Connx Plus & Elite ) -Conduct machine setup Minor/Major, alignment, recipe loading, and basic parameter adjustments.

-Perform regular machine checks, cleaning, and minor preventive maintenance. -Identify process abnormalities, machine errors, and reject trends; report issues to engineers or supervisors promptly. -Assist in troubleshooting equipment issues and support engineering improvement activities. -Record production data accurately in system and ensure proper documentation.

-Ensure workplace 5S, safety compliance, and proper ESD handling at all times Requirements: Certificate/Diploma in Electrical, Mechanical, Mechatronics, or related fields. Experience in semiconductor die attach/die bonding / wire bonding/ mold-trim / final test process is an added advantage. Able to work in shift Basic troubleshooting and machine-handling skills.

Good teamwork, discipline, and communication skills. Willing to learn and adapt in fast-paced production environment