Mold and Symbol Trim Form (EOL) Equipment Engineer (MES Project)

Change the world. Love your job. Join TI as a specialized Equipment Engineer to drive the digital transformation of our to drive the digital transformation of our End-of-Line (EOL) manufacturing, specifically covering Mold and Symbol Trim Form (STF) operations. This is a unique, multi-phase role: following a 1 month TI orientation familiarizing with TI systems while being deployed into a critical MES implementation project team for 1–2 years.

Upon successful project completion, you will transition into a production role, utilizing your deep MES expertise to optimize equipment uptime and automation in a high-volume manufacturing environment.

Key Responsibilities

MES Implementation (Project Phase): Represent EOL Equipment Engineering in the MES rollout. Define equipment workflows, setup/recipe controls, qualification requirements, equipment states, and interlocks for both Mold and STF machines. Digital Integration: Translate physical shop-floor requirements (e.g., Mold cure/pressure/temp and STF mechanical/trimming parameters) into digital process designs and data collection needs.

Validation: Validate equipment integration scenarios and support User Acceptance Testing (UAT) and deployment for both process areas. Sustaining (Post-Project Phase): Transition to production to manage equipment reliability, troubleshoot MES-related equipment issues, and drive continuous improvement in automation and uptime.

Minimum Requirements: Minimum Education (Bachelor's degree Electrical Engineering, Electrical Computer Engineering, Chemical Engineering, Mechanical Engineering, Materials Science Engineering,) Physics or related engineering degree Strong hands-on semiconductor equipment experience in with Mold equipment (e.g., Towa, ASM) AND/OR Symbol Trim Form equipment (e.

g., ASM, Besi) with minimum 2 years of relevant experience Preferred Qualifications: Experience with tool monitoring/interdiction software and SPC techniques. Experience working with MES platforms , whether Siemens Op. Center or another comparable MES product modeling or configuration Working awareness of PAC-related integration and adjacent automation flows, sufficient to identify cross-system impacts and escalate early Experience on tool monitoring and interdiction software, and equipment maintenance and documentation Working knowledge of semiconductor manufacturing, and SPC techniques.

Experienced with semiconductor cleanroom protocol and behaviors. Strong verbal and written communication skills Demonstrated strong analytical, critical thinking and problem solving skills Ability to work in teams and collaborate effectively with people in different functions Ability to take the initiative and drive for results Strong time management skills that enable on-time project delivery Ability to work effectively in an interrupt-driven, fast-paced and rapidly changing environment Demonstrated ability to build strong, influential relationship