Senior Product Manager

Product Manager Multi-Die Package / System-in-Package Products Job Description

1. Market Insight and Analysis

• Closely monitor market dynamics and technology trends for highly integrated semiconductor products, including multi-die packages and system-in-package solutions that combine MCUs, gate drivers, power devices, power-management devices, and memory devices.
• Analyze target applications, customer needs, competitor portfolios, supply-chain conditions, cost structures, and packaging technology roadmaps; regularly deliver market research, opportunity assessments, and product strategy recommendations.
• Work closely with sales, field application, engineering, operations, and key customers to identify system-level pain points and translate them into differentiated integration opportunities and product concepts.

1. Product Definition and Management

• Develop product roadmaps and portfolio plans for multi-die package products; define product positioning, target markets, application scenarios, competitive value propositions, and business priorities.
• Lead system-level product definition across MCU, gate-driver, power-device, power-management, and memory functions, balancing electrical performance, thermal performance, reliability, package size, cost, manufacturability, and supply continuity.
• Define package architecture, die partitioning, interconnection approach, pinout, power and signal integrity requirements, thermal design targets, test strategy, quality and reliability goals, and hardware/software ecosystem requirements in collaboration with R&D and packaging teams.
• Draft and maintain MRDs, PRDs, product specifications, business plans, and project requirements, ensuring clear alignment across design, packaging, test, quality, operations, marketing, and sales teams.
• Lead feasibility assessment, business-case development, project initiation, development reviews, risk management, product validation, qualification, and new product introduction to ensure on-time and high-quality delivery.
• Take ownership of the full product lifecycle from concept and definition through mass production, portfolio optimization, change management, and end-of-life planning.

1. Partner and Supply-Chain Management

• Coordinate internal and external resources across wafer suppliers, OSAT partners, substrate and lead-frame suppliers, test houses, and ecosystem partners to support product development and scalable production.
• Participate in partner evaluation and selection, technical and commercial alignment, capacity planning, quality improvement, cost optimization, and supply-risk mitigation.

1. Data Analysis and Decision Support

• Track product performance, design wins, revenue, gross margin, forecast, yield, quality, customer feedback, and competitive developments to evaluate business health and product competitiveness.
• Use market and operational data to recommend roadmap adjustments, cost-reduction priorities, package or process improvements, and investment decisions to management.

Qualifications

Education

Background

• Bachelor’s degree or above in Electronic Engineering, Microelectronics, Semiconductor Engineering, Materials Science, Automation, or a related discipline. A master’s degree or MBA is preferred.

1. Work Experience

• Minimum 8 years of experience in semiconductor product management, product definition, system architecture, packaging engineering, application engineering, or related roles.
• Proven hands-on experience with multi-die packaging or system-in-package products integrating two or more of the following device categories: MCU, gate driver, power device, power-management device, and memory device.
• Demonstrated experience leading cross-functional semiconductor products from market opportunity and definition through development, qualification, mass production, and market launch.

1. Professional Skills

• Product and System Expertise: Strong understanding of MCU architecture, gate-driver functions, power semiconductors, power-management devices, and memory technologies, including their system interactions and application trade-offs.
• Packaging and Process Expertise: In-depth knowledge of semiconductor packaging architecture, die attach, interconnect, substrates or lead frames, thermal management, signal and power integrity, assembly, test, reliability, qualification, yield, and cost drivers.
• Market Insight: Deep understanding of markets and applications where integration creates measurable value, with the ability to assess customer requirements, competitive alternatives, pricing, supply-chain factors, and business potential.
• Documentation Skills: Proficient in developing MRDs, PRDs, product specifications, business plans, product roadmaps, competitive analyses, and executive decision materials.

1. Comprehensive Competencies

• Communication & Collaboration: Strong cross-functional leadership and stakeholder-management skills, with the ability to align design, packaging, test, quality, operations, suppliers, sales, and customers around complex product decisions.
• Commercial Acumen: Strong business-case, pricing, cost, margin, and portfolio-management capabilities, with sound judgment in balancing technical differentiation and commercial return.
• English Proficiency: Fluent professional English, with the ability to read international technical documentation and participate effectively in cross-border technical and business discussions. More information about NXP in Greater China... #LI-67af