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TM-Firmware Engineer(Local)-Shenzhen
Shenzhen, ChinaPosted Nov 9, 2026
Job description
工作职责： 1. 负责空调产品单板软硬件设计开发； 2.负责市场及生产问题的处理和解决； 3.上级主管交付的其他工作。 职位要求： 1.本科及以上学历，电气、电子、计算机、自动控制及相关专业； 2.有电子产品单板软、硬件开发经验； 3. 熟练掌握单片机或DSP相关开发环境，熟练掌握C ，C++ 汇编语言编程； 4. 熟悉CAN, RS485,ETHERNET, PLC； 5.能独立思考和解决问题，勤奋认真,善于团队合作。 6.英语四级以上
Description copied from Vertiv's careers page. Read the full posting before you apply.
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