Senior Process Engineer

1. Process Development: Operate and optimize Photolithography equipment for ASML i-Line Stepper Systems , by defining and tuning process recipes (focus, exposure dose, alignment, etc.) Perform routine process monitoring and troubleshooting on ASML i-Line steppers, including tool qualification, SPC tracking, and defect analysis, ensuring stable and repeatable process performance. Analyze process and metrology data to identify improvement opportunities, drive root-cause analysis, and implement robust corrective and preventive actions (CAPA) to enhance yield, throughput, and process stability. Assist in MEMS technology development, focusing on the setup and optimization of Photolithography, Screen Printing, and Bonding processes in a semiconductor environment. Assist in the development, characterization, and optimization of Photolithography, Screen Printing, and Bonding processes for semiconductor manufacturing.
2. Process Monitoring and Control:

• Monitor and control process to ensure consistent and high-quality output.
• Troubleshoot process issues and implement corrective actions.

1. Documentation and Reporting:

• Maintain detailed documentation of process parameters, experiments, and results.
• Prepare technical reports and presentations to communicate findings and recommendations to the engineering team.
• Update process documentation and standard operating procedures (SOPs) as needed.

1. Collaboration and Teamwork:

• Work closely with cross-functional teams, including R&D, production, and quality assurance, to ensure seamless integration of photolithography, screen printing and bonding processes.
• Participate in team meetings and contribute to problem-solving discussions.
• Provide support to shift engineers and shift technicians as required.

1. Continuous Improvement:

• Participate in continuous improvement initiatives to enhance process efficiency, yield, and quality.
• Identify opportunities for process automation and implement solutions.

Requirements

Bachelor’s degree in electrical & Electronics, Mechatronics, Physics/Applied Physics, Materials Science, Chemical or Mechanical Engineering studies Skill and abilities: Understanding of photolithography or bonding principle and semiconductor process. Knowledge of EKRA printing and bonding processes will be considered an advantage.

Knowledge of data analysis and statistical process control. Hands-on experience with photolithography equipment (Track: DNS/TEL, Stepper: Canon/ASML, Aligner: EVG/SUSS), Screen printing (EKRA) and Bonding (EVG) equipment is highly desirable. Good communication and teamwork skills. Work independently and able to do multitask effectively.