(05)【2026新幹班】半導體類 Semiconductor

TaiwanPosted Oct 5, 2026

Job description

協助執行 IC 設計驗證、先進封裝測試與製程數據分析。參與功率半導體研發專案的實驗採集;配合追蹤良率數據,學習車用電子零件之設計與整合規範。 Assist in IC design verification, advanced packaging testing, and process data analysis. Participate in power semiconductor R&D data collection. Support yield tracking and learn automotive component design specs.

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