Technician I, Equipment Engineering

Responsible for the immediate repair of Dicing Saw and Tape and Reel handlers including AOI Performed equipment conversion based on the SUS provided by Production and Planning. Ensure all completed equipment conversion meet the required specs before release to production above the target. Monitor equipment uptime performance, verifies the causes of downtime and ensure handler uptime within or above the target Responsible in providing RCA and CAPA on all equipment related issues and downtime Supports continuous improvement projects assigned by immediate superior Responsible to maintain 5S.

Who we are looking for College Level or Any Vocational Technical Course (Electrical, Electronics, Mechanical or Electro-Mechanical) With Semiconductor Industry experience is advantage Basic Technical Knowledge on Wafer Level Package equipment such as Dicing Saw and Die Taping machine With minimum level experience in Semiconductor Industry particularly on Wafer Saw and Tape and Reel equipment Please contact Soi Kim Kee for further information via suki.

kee@ams-osram.com or +65 () 62402395 .