Lead, Advanced Manufacturing Engineer (DFM/A & NPI Architecture)

Company Overview Our client is a Global Leader & Premier Manufacturer of Advanced Power Conversion Solutions. Designing and manufacturing critical power supplies, controllers, and complex electronic subsystems for global blue-chip clients across the Healthcare, Industrial Technology, and Semiconductor Equipment sectors, the company operates a state-of-the-art manufacturing facility in Seri Iskandar, Perak.

To spearhead Design for Manufacturability/Assembly (DFM/A) frameworks, drive new manufacturing technologies, and bridge the gap between R&D concept design and plant-level production ramp, the engineering leadership is recruiting a Lead Advanced Manufacturing Engineer (AME).

Position Overview

Reporting directly to the Director of Engineering, the Lead Advanced Manufacturing Engineer (AME) acts as the vital engineering bridge connecting Factory Operations, DFX, and Global R&D Design Engineering teams. This technical leadership role owns the manufacturing architecture for "New, Unique, Different & Difficult" (NUDD) product designs—evaluating complex structures, introducing advanced materials, and driving robust process industrialization from early prototype kick-off through mass volume ramp-up.

The incumbent ensures high first-pass yields, drives lean cell architectures, and eliminates late-stage tooling and process redesigns.

Key Responsibilities

1. DFM/DFA Leadership & Cross-Functional Engineering Interface Serve as the primary technical interface between global Design Engineering, DFX groups, and shopfloor manufacturing operations. Evaluate early project kick-offs, identifying critical product structural risks, assembly interferences, and fixture constraints to prevent late-stage engineering changes. Enforce Design for Manufacturability (DFM) and Design for Assembly (DFA) best practices across mechanical chassis integration, thermal management structures, and PCBA layouts.
2. NUDD Process Design & Technology Industrialization Formulate and develop robust manufacturing processes for NUDD (New, Unique, Different & Difficult) product platforms incorporating new material sciences, metallurgy, and polymers. Architect comprehensive process documentation from scratch—including Process Flow Diagrams (PFD), Process Failure Mode and Effects Analysis (PFMEA), and Process Control Plans (PCP). Investigate, qualify, and introduce advanced manufacturing technologies, automated assembly equipment, and Design for Automation (DFA) concepts to elevate line throughput and product quality.
3. Complex PCBA, Mechanical Integration & Process Validation Provide deep engineering governance across high-complexity PCBA assembly processes—encompassing Surface Mount Technology (SMT), fine-pitch/large BGA placement, wave/selective soldering, rework protocols, conformal coating, and potting encapsulation. Oversee mechanical chassis assembly of PCBAs, conducting rigorous Tolerance Stack-Up Analysis and Geometric Dimensioning and Tolerancing (GD&T) reviews. Lead process characterization, verification, and qualification trials using advanced statistical tools (GR&R, Cp/Cpk, Design of Experiments / DOE) to optimize first-pass yields from prototype to high-volume ramp.
4. Metrology, Continuous Improvement & Risk Analysis Utilize high-precision mechanical metrology tools (OMM, CMM, displacement lasers, confocal microscopy) to validate critical part dimensions and structural integrity. Lead Kaizen initiatives, Lean manufacturing principles, and advanced root-cause failure troubleshooting to systematically eliminate process variations and bottlenecks. Analyze and synthesize potential failure risks across existing manufacturing lines, presenting improvement strategies directly to senior engineering leadership.

Requirements

Bachelor’s Degree in Mechanical Engineering, Mechatronics, Manufacturing Engineering, or a related technical discipline. Work Experience: Minimum 5+ years of progressive engineering experience in Advanced Manufacturing Engineering, NPI industrialization, or Process Development within electronics manufacturing. Certifications: Lean Six Sigma Green Belt or Black Belt certification is strongly preferred.

Technical Competencies & Expertise Electronics & PCBA Mastery: In-depth working knowledge of high-complexity PCBA assembly (SMT, wave soldering, large/small BGA assembly, conformal coating, potting) and PCBA-to-chassis electro-mechanical integration. Mechanical & Metrology Depth: Demonstrated proficiency in GD&T, tolerance stack-up analysis, and mechanical metrology systems (CMM, OMM, laser measurement).

Software & Design Tools: Proficient in CAD software (AutoCAD 2D/3D, Solid. Works, or UG NX); strong command of statistical packages (Minitab, JMP, or MATLAB). Methodologies: Solid track record in PFMEA development, Process Control Plans, DOE, SPC, Cp/Cpk analysis, and Lean manufacturing deployment. Leadership & Personal Attributes Decisive, hands-on engineering leader with demonstrated capability to lead cross-functional projects and negotiate technical requirements with external suppliers and design teams.

Exceptional verbal, presentation, and written communication skills in English. Mobility: Willingness to travel within Southeast Asia and broader Asia regions for project coordination, technology transfers, or supplier audits when required.