EOL Package SAW Engineer (Dicing & Singulation)

Company Overview Our client is a Global Semiconductor Pioneer & World Leader in High-Performance Analog, Mixed-Signal & Integrated Power Processing Technologies. Operating a premier semiconductor manufacturing complex in Melaka, the site handles complex back-end wafer processing, assembly, package singulation, and final test operations.

To strengthen technical authority across its dicing and package singulation lines, the EOL Engineering team is recruiting a Senior EOL Package SAW Engineer.

Position Overview

Reporting to the EOL Section Manager, the EOL Package SAW Engineer serves as the primary technical specialist for End-of-Line mechanical dicing, wafer sawing, and package singulation. This senior individual contributor role owns process parameter development, diamond blade saw optimization, and defect reduction across high-precision dicing platforms.

Key Responsibilities

1. Process Ownership & Dicing Parameter Optimization Own and drive End-of-Line (EOL) wafer mechanical sawing, package dicing, and singulation process engineering. Optimize diamond blade parameters—including spindle RPM, feed rates, cut depth, dress parameters, and cooling water nozzle flow dynamics—to eliminate top/backside die chipping, micro-cracks, and sidewall delamination. Manage dicing tape selections, UV-release tape irradiation parameters, frame lamination tension, and kerf width controls.
2. Equipment Platform Management & NPI Qualification Drive continuous equipment performance optimization on high-precision dicing platforms (e.g., DISCO DAD, ACCRETECH/TSK, K&S). Establish robust SPC controls, line qualification standards, and root-cause containment protocols for new package introductions and thin-wafer singulation. Conduct blade life evaluations, cost-down initiatives, and yield improvement programs.

Requirements

Bachelor’s Degree in Mechanical, Microelectronics, Manufacturing, or Materials Engineering. Work Experience: 8 to 10 years of dedicated semiconductor back-end dicing, wafer sawing, and package singulation experience. Domain Expertise: Expert-level, hands-on experience with mechanical diamond blade dicing equipment platforms (DISCO/TSK systems) and dicing/UV tape material interactions.

Technical Proficiency: Deep knowledge of silicon micro-cracking mechanisms, blade wear dynamics, kerf alignment verification, and SPC methodology.